A METALLIZATION PROVIDING TWO LEVELS OF INTERCONNECT FOR BEAM-LEADED SILICON INTEGRATED CIRCUITS.RYDEN WD; LABUDA EF.1977; I.E.E.E.J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1977; VOL. 12; NO 4; PP. 376-382; BIBL. 17 REF.Article

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DOMINANT DIFFUSION MECHANISM IN RHSI FORMATIONMGBENU EN.1978; THIN SOLID FILMS; NLD; DA. 1978; VOL. 50; PP. L13-L16; BIBL. 12 REF.Article

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DETECTION OF SPUTTER CONTAMINATION AND SPUTTER ETCH RESIDUE BY ION MICROPROBE ANALYSISANDREWS JM; KATE LE; COLBY JW et al.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 67; NO 2; PP. 325-340; BIBL. 20 REF.Article

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METHODS FOR PRODUCING SOLDERABLE, RIGID TERMINALS ON FLEXIBLE PRINTED CIRCUITS.JEAN LH.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 2; PP. 45-47Article

CHIPFUEGEN-EIN UEBERBLICK. = ASSEMBLAGE DE PUCES-APERCULABS J; SCHEEL W.1978; NACHR.-TECH., ELEKTRON.; DDR; DA. 1978; VOL. 28; NO 7; PP. 284-287; ABS. RUS/ENG; BIBL. 24 REF.Article

A HIGH SPEED ECL MULTIPLEXER IN BEAM LEAD, HYBRID TECHNOLOGY.COUGHLIN JB; HUGHES JB; WATTS RS et al.1977; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1977; VOL. 4; NO 3-4; PP. 185-191; BIBL. 4 REF.Article

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GAAS SCHOTTKY BARRIER DEVICES AND COMPONENTSCALVIELLO JA.1979; MICROWAVE J.; USA; DA. 1979; VOL. 22; NO 9; PP. 92-96; BIBL. 15 REF.Article

A NOVEL BEAM LEAD GAAS SCHOTTKY-BARRIER DIODE FABRICATED BY USING THICK POLYIMIDE FILMHARADA Y; FUKUDA H.1979; I.E.E.E. TRANS. ELECTRON DEVICES; USA; DA. 1979; VOL. 26; NO 11; PP. 1799-1804; BIBL. 7 REF.Article

FATIGUE FAILURE OF ENCAPSULATED GOLD-BEAM LEAD AND TAB DEVICESDAIS JL; HOWLAND FL.1978; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 2; PP. 158-166; BIBL. 17 REF.Article

FAISABILITE DE DIODES PIN PAR IMPLANTATIONSBOUVET JV; CALLIGARO FS.1978; ; FRA; DA. 1978; DGRST 77 7 1000; 20 P.; 30 CM; BIBL. 4 REF.; ACTION CONCERT.: COMPOS. CIRCUITS MICROMINIAT.Report

DETERMINATION OF TEMPERATURE OF INTEGRATED-CIRCUIT CHIPS IN HYBRID PACKAGING.ER YUNG YU.1976; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1976; VOL. 12; NO 2; PP. 139-146; BIBL. 2 REF.Article

ENCAPSULATION OF INTEGRATED CIRCUITS CONTAINING BEAM LEADED DEVICES WITH A SILICONE RTV DISPERSION.JAFFE D.1976; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1976; VOL. 12; NO 3; PP. 182-187; BIBL. 10 REF.Article

PRELOADING COMPLIANT BONDING TAPE WITH BEAM-LEAD INTEGRATED CIRCUITS.GRUSZKA RF.1976; WEST. ELECTR. ENGR; U.S.A.; DA. 1976; VOL. 20; NO 4; PP. 16-21Article

SELECT THE BEST DIODE FOR MILLIMETER MIXERS.WRIXON GT.1976; MICROWAVES; U.S.A.; DA. 1976; VOL. 15; NO 9; PP. 56-60 (3P.); BIBL. 5 REF.Article

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WIDEBAND MM-WAVE MIXERS FOR EW APPLICATIONSBALL DW; BUI LQ.1982; MICROWAVE J.; ISSN 0026-2897; USA; DA. 1982; VOL. 25; NO 6; PP. 65-76; 5 P.; BIBL. 4 REF.Article

PLANARER GEGENTAKTMISCHER AUF AL₂O₃-SUBSTRAT FUER DEN 20-GHZ-BEREICH = MELANGEUR PLAN EQUILIBRE SUR SUBSTRAT AL₂O₃ DANS LE DOMAINE DES 20 GHZHAUTH W.1981; FREQUENZ; ISSN 0016-1136; DEU; DA. 1981; VOL. 35; NO 2; PP. 30-35; ABS. ENG; BIBL. 16 REF.Article

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